SASMOS HET Technologies and The ePlane Company have signed an MoU to co-develop the electrical wiring interconnection system for the e200X eVTOL. The agreement puts SASMOS into ePlane’s industrialisation path, covering harness architecture, design for manufacturability, prototype evaluation and certification readiness as the aircraft moves toward production. The pairing matters because EWIS drives weight, reliability and compliance in electric aircraft, where wiring architecture can shape both performance and certification burden. The deal also extends the build-out of India’s domestic aerospace supply chain, with ePlane aligning multiple suppliers around avionics, composites, fasteners and interiors for the modular platform.